Compact achromats are 3D printed inside a mesoporous host allowing dense integration of multiple elements that do not require external supports for alignment. Broadband visible wavelength focusing efficiencies with minimal chromatic error are achieved.
This poster describes a new end-to-end virtual prototype solution we have developed for simulating the performances of the whole system of a CMOS Image Sensor Camera from the imaging lens system to the final image, through the optoelectronic sensor itself. Finite Difference Time Domain (FDTD) software is used to simulate how much light is absorbed by the CMOS sensor structure and the diffraction effects throughout the micro-lenses and pixels. 3D Charge Transport Solver is used to compute the probability to capture a photogenerated charge and get the quantum efficiency as a function of the incident angles, wavelengths, and pixel position. Finally, we combine light exposure onto the sensor from 3D environment raytracing software with quantum efficiency from photonics simulations to generate raw images and compute the final image.
Efficient fiber-to-waveguide coupling is critical for photonic integrated circuits. However, it is very challenging because of the mode mismatch and high sensitivity to misalignment between the fiber and the waveguide. To address this challenge, various coupling mechanisms have been exploited using sophisticated coupler designs involving complex light interactions with structures from the microscale to the macroscale. Simulations of these complex interactions are essential for the coupler design. Here, we are introducing a multi-scale simulation workflow to design the coupler making use of the interoperability between Ansys Lumerical and Ansys Zemax OpticStudio.
Despite tremendous progress in the integrated photonics ecosystem over recent years, and the commercial success of many products, there remain some important challenges and opportunities. We discuss some of the key simulation challenges related to the design, simulation, and optimization of advanced components such as lasers, isolators, and novel passive components created with photonic inverse design methods. We also discuss system level simulation challenges such as handling spatial correlations when performing statistical analysis and dealing with thermal management.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.