The rapid of development of the Internet of Things (Iot), 5G communications, and smart technologies placing higher demands on storage-integrated hardware devices. The discovery of HfO2-based ferroelectric materials has opened up a new avenue for achieving low-power logic and high-density non-volatile memory by utilizing this silicon-tolerant ferroelectric material. In this work, a 10 nm Hf0.5Zr0.5O2 (HZO) ferroelectric films ware prepared on SrTiO3 (STO) substrate using an atomic layer deposition system (ALD). After rapid annealing treatment, the surface roughness of HZO films showed nanometer level (Ra~1.033 nm, Rq~1.321 nm). HZO ferroelectric films with molybdenum (Mo) electrodes exhibit low coercive field (Ec~1.48 MV/cm) and excellent ferroelectric property (2Pr~56.143 µC/cm2 , and 2Pmax~ 81.070 µC/cm2). Under the fatigue signal of 100 kHz, the device exhibits stable anti-fatigue characteristics. Mo/HZO/Mo/STO devices exhibit fast response time (1ms) and stable polarization retention characteristics (over 103 s). This work introduces a novel method for the next-generation non-volatile memory solutions (NVM).
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.