Dr. Shahin Zangooie
Principal Development Engineer at Western Digital Corp
SPIE Involvement:
Author
Publications (8)

SPIE Journal Paper | 16 October 2014
Jie Li, Shahin Zangooie, Karthik Boinapally, Xi Zou, Jiangtao Hu, Zhuan Liu, Sanjay Yedur, Peter Wilkens, Avraham Ver, Robert Cohen, Babak Khamsehpour, Holger Schroder, John Piggot
JM3, Vol. 13, Issue 04, 041406, (October 2014) https://doi.org/10.1117/12.10.1117/1.JMM.13.4.041406
KEYWORDS: Critical dimension metrology, Scatterometry, Line edge roughness, Reactive ion etching, Metrology, Scatter measurement, Semiconducting wafers, Optics manufacturing, Magnetism, Etching

Proceedings Article | 2 April 2014 Paper
Jie Li, Shahin Zangooie, Karthik Boinapally, Xi Zou, Jiangtao Hu, Zhuan Liu, Sanjay Yedur, Peter Wilkens, Avraham Ver, Robert Cohen, Babak Khamsepour
Proceedings Volume 9050, 90502T (2014) https://doi.org/10.1117/12.2046639
KEYWORDS: Reactive ion etching, Scatterometry, Critical dimension metrology, Metrology, Magnetism, Manufacturing, Photomasks, Etching, Measurement devices, Semiconducting wafers

Proceedings Article | 2 April 2014 Paper
Shahin Zangooie, Jie Li, Karthik Boinapally, Peter Wilkens, Avraham Ver, Babak Khamsepour, Holger Schroder, John Piggot, Sanjay Yedur, Zhuan Liu, Jiangtao Hu
Proceedings Volume 9050, 90501G (2014) https://doi.org/10.1117/12.2046165
KEYWORDS: Scatterometry, Critical dimension metrology, Line edge roughness, Scatter measurement, Semiconducting wafers, Metrology, Reactive ion etching, Manufacturing, Ellipsometry, Data modeling

Proceedings Article | 10 April 2013 Paper
Shahin Zangooie, Satyanarayana Myneni, Peter Wilkens, Nicholas Keller, Thankasala Sarathy, Milad Tabet
Proceedings Volume 8681, 86811S (2013) https://doi.org/10.1117/12.2011616
KEYWORDS: Scatterometry, Reactive ion etching, 3D metrology, Semiconducting wafers, 3D acquisition, Ions, Metrology, Critical dimension metrology, Scatter measurement, 3D modeling

Proceedings Article | 22 March 2008 Paper
Proceedings Volume 6922, 69220S (2008) https://doi.org/10.1117/12.773088
KEYWORDS: Copper, Scatterometry, Back end of line, Metals, Critical dimension metrology, Semiconducting wafers, Chemical mechanical planarization, Metrology, Inspection, Dielectrics

Showing 5 of 8 publications
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