Dr. Wolfgang A. Cabanski Profile

Dr. Wolfgang A. Cabanski

Managing Director at AIM INFRAROT-MODULE GmbH

SPIE Involvement:

Conference Program Committee | Author

Publications (42)

Proceedings Article | 7 May 2009 Paper

HgCdTe technology in Germany: the past, the present, and the future

W. Cabanski, J. Ziegler

Proceedings Volume 7298, 72982O (2009) https://doi.org/10.1117/12.818606

KEYWORDS: Sensors, Curium, Liquid phase epitaxy, Infrared sensors, Mercury cadmium telluride, Long wavelength infrared, Defense and security, Array processing, Forward looking infrared, Staring arrays

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The first HgCdTe (MCT) activities at AEG-Telefunken in Germany were started in 1976. As part of the closing of AEG, the Heilbronn based IR-technology division was established as a spin-off company in 1995, under the brand name of AIM Infrarot-Module GmbH. A rapidly growing team of scientists focused on the detector-dewar-cooler technology and the development of linear photoconductive MCT arrays by applying the solid-state-recrystallization (SSR) technique for MCT growth, depositing and thinning MCT on sapphire substrates and oxide passivation. In 1979, after successful development of an own MCT-technology base, AEG-Telefunken entered into a license agreement with Texas Instruments for US Common Module (CM) technology in order to speed up the entry into full scale production with a transfer of MCT-material, dewar and cooler processes. CMs are still manufactured in small numbers. At the same time, a proprietary pc-MCT technology, independent of the CM production line, was developed and continuously matured and is today successfully applied in various custom designs like detectors for smart ammunition, for commercial and space applications. In 1982 started the development of 2nd Gen. photovoltaic MCT detectors, based on liquid-phase-epitaxy (LPE) in tilting and dipping technique and on planar array technology with Hg-Diffusion and ion implantation for pn-junction formation and CdTe/ZnS passivation. Linear MCT arrays in the 8-10,5 μm wavelength range with state of the art electro-optical performance have rapidly been demonstrated. Within the frame of the European anti-tank program TRIGAT, a two-way know-how-transfer between AEGTelefunken and SOFRADIR was established for linear LW MCT array processing, flip-chip-technology and dewar technology. Today, AIM's 2^nd Gen. portfolio is based on MCT-LPE in dipping technique on CdZnTe substrates, characterized by a very low defect and dislocation density for 0,9 μm to 15μm wavelength application. Array processing is performed by planar technique, Boron ion implantation, CdTe/ZnS passivation and intrinsic or extrinsic doping, respectively. Infrared systems with AIM's linear and 2-dim. Focal-Phase-Arrays are used in many state of the art programs in Germany and internationally for surveillance and targeting, seeker head systems or for spaceborne applications like e.g. hyperspectral imaging. AIM's current MCT developments include for example MW/LW-MBE-MCT layers and array processing for 3^rd Gen. detectors, avalanche NIR-MCT photodiodes for low background application, MBE on 4" alternative substrates and 2- dim. arrays with very long 15μm cut-off for space-based application to meet the future demands of IR-systems.

Proceedings Article | 14 May 2007 Paper

Dual color IR detection modules, trends and applications

M. Münzberg, R. Breiter, W. Cabanski, K. Hofmann, H. Lutz, J. Wendler, J. Ziegler, R. Rehm, M. Walther

Proceedings Volume 6542, 654207 (2007) https://doi.org/10.1117/12.718798

KEYWORDS: Sensors, Superlattices, Stereolithography, Staring arrays, Quantum well infrared photodetectors, Missiles, Medium wave, Infrared detectors, Sniper detection, Mid-IR

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The 3rd generation of infrared (IR) detection modules is expected to provide advanced features like higher resolution 1024x1024 or 1280x720 pixels and/or new functions like multicolor or multi band capability, higher frame rates and better thermal resolution. This paper is intended to present the current status and trends at AIM on antimonide type II superlattices (SL) dual color detection module developments for ground and airborne applications in the high performance range, where rapidly changing scenes - like e.g. in case of missile warning applications for airborne platforms or ground based sniper detection systems - require temporal signal coincidence with integration times of typically 1ms. AIM and IAF selected antimonide based type II superlattices (SL) for such kind of applications. The type II SL technology provides - similar to QWIP's - an accurate engineering of sensitive layers by MBE with very good homogeneity and yield. IAF and AIM managed already to realize a dual color 384x288 IR module based on this technology. It combines spectral selective detection in the 3 - 4&mgr;m wavelength range and 4 - 5 &mgr;m wavelength range in each pixel with coincident integration in a 384x288x2 format and 40x40 &mgr;m² pitch. Excellent thermal resolution with NETD < 12 mK @ F/2, 2.8 ms for the longer wavelength range (red band) and NETD < 22 mK @ F/2, 2.8 ms for the shorter wavelength range (blue band) were reported. In the meantime a square design of 256x256x2 pixel with a reduced pitch of 30x30 &mgr;m² is in preparation. In this case with 2 Indium bumps per pixel and a third common contact for all pixels required for temporal coincidence is connected at the outer area of the array. The fill factor is approx. 65% for both wavelength ranges. The reduced size of the array enables the use of a smaller dewar with reduced cooling power and significantly reduced weight and broadens the scope of applications where weight and costs is essential. Design aspects and expected performances are discussed.

Proceedings Article | 14 May 2007 Paper

InAs/GaSb type-II short-period superlattices for advanced single and dual-color focal plane arrays

Martin Walther, Robert Rehm, Joachim Fleissner, Johannes Schmitz, Johann Ziegler, Wolfgang Cabanski, Rainer Breiter

Proceedings Volume 6542, 654206 (2007) https://doi.org/10.1117/12.719227

KEYWORDS: Sensors, Stereolithography, Staring arrays, Cameras, Gallium antimonide, Mid-IR, Superlattices, Imaging systems, Thermography, Indium arsenide

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Proceedings Article | 7 September 2006 Paper

Second and third generation thermal imagers based on type-II superlattice photodiodes

Robert Rehm, Martin Walther, Johannes Schmitz, Joachim Fleißner, Johann Ziegler, Wolfgang Cabanski, Rainer Breiter

Proceedings Volume 6294, 629404 (2006) https://doi.org/10.1117/12.680495

KEYWORDS: Mid-IR, Sensors, Missiles, Stereolithography, Superlattices, Cameras, Staring arrays, Thermography, Imaging systems, Image processing

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Proceedings Article | 18 May 2006 Paper

Multispectral IR detection modules and applications

M. Münzberg, R. Breiter, W. Cabanski, H. Lutz, J. Wendler, J. Ziegler, R. Rehm, M. Walther

Proceedings Volume 6206, 620627 (2006) https://doi.org/10.1117/12.665467

KEYWORDS: Sensors, Quantum well infrared photodetectors, Stereolithography, Superlattices, Staring arrays, Spectroscopy, Missiles, Quantum efficiency, Readout integrated circuits, Infrared detectors

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This paper is intended to present firstly the current status at AIM on quantum well (QWIP) and antimonide superlattices (SL) detection modules for multi spectral ground and airborne applications in the high performance range i.e. for missile approach warning systems and secondly presents possibilities with long linear arrays i.e. 576x7 MCT to measure spectral selective in the 2 - 11μm wavelength range. QWIP and antimonide based superlattice (SL) modules are developed and produced in a work share between AIM and the Fraunhofer Institute for Applied Solid State Physics (IAF). The sensitive layers are manufactured by the IAF, hybridized and integrated to IDCA or camera level by AIM. In case of MCT based modules, all steps are done by AIM. QWIP dual band or dual color detectors provide good resolution as long as integration times in the order of 5-10ms can be tolerated. This is acceptable for all applications where no fast motions of the platform or the targets are to be expected. For spectral selective detection, a QWIP detector combining 3-5 μm (MWIR) and 8-10 μm (LWIR) detection in each pixel with coincident integration has been developed in a 384x288x2 format with 40 μm pitch. Excellent thermal resolution with NETD < 30 mK @ F/2, 6.8 ms for both peak wavelengths (4.8 μm and 8.0 μm) has been achieved. Thanks to the well established QWIP technology, the pixel outage rates even in these complex structures are well below 0.5% in both bands. The spectral cross talk between the two wavelength bands is equal or less than 1%. The substrate on the sensitive layer of the FPA was completely removed in this case and as a consequence the optical crosstalk in the array usually observed in QWIP arrays resulting in low MTF values was suppressed resulting in sharp image impression. For rapidly changing scenes - like e.g. in case of missile warning applications for airborne platforms - a material system with higher quantum efficiency is required to limit integration times to typically 1ms. AIM and IAF selected antimonide based type II superlattices (SL) for such kind of applications. The type II SL technology provides - similar to QWIPs - an accurate engineering of sensitive layers by MBE with very good homogeneity and potentially good yield and resistivity against high temperature application i.e. under processing or storage. While promising results on single SL pixels have been reported since many years, so far no SL based detection module could be realized with reasonable performances. IAF and AIM last year managed to realize first most promising SL based detectors. Fully integrated IDCAs with a MWIR SL single color device with 256x256 pixels in 40 μm pitch have been integrated and tested. In the next step the pitch was reduced to 24μm in a 384x288 pixel configuration. With this design and further improved technology a very good pixel operabilities with very low cluster sizes (≤ 4 pixel) and performances with quantum efficiencies as high as known from MCT is reached in the meantime. A dual color device based on SL technology on the existing 384x288 read-out circuit (ROIC) as used in the dual band QWIP device is available. It combines spectral selective detection in the 3-4.1 μm wavelength range and 4.1-5 μm wavelength range in each pixel with coincident integration in a 384x288x2 format and 40 μm pitch. Excellent thermal resolution with NETD < 17 mK @ F/2, 2.8 ms for the longer wavelength range (red band) and NETD < 30 mK @ F/2, 2.8 ms for the shorter wavelength range (blue band) has been achieved. The pixel outage rates remains below 1% in both colors. The spectral cross talk of the red band to the blue band is estimated below 1%o which is important to reduce significantly the false alarm rate in missile approach warning systems as the primarily intended use of the dual color detector is. Real time analysis of gases, i.e. the detection of toxic or agent gases, by multi spectral detection in the IR used the characteristic infrared emission or absorption lines of different gas types. Spectroscopic systems consisting of a spectrometer with the need for large linear MCT array with small pixel sizes are used in this case. Possibilities are outlined to use long linear arrays, such as the 576x7 MCT detector, to perform spectral selective measurements in the 2-11μm wavelength range. For these applications a 576x7 MCT FPA is integrated in an open dewar cooler assy without window able to operate directly coupled in an evacuated and cooled spectrometer. The sensitivity of the array is consequently not limited by the transmission of a window for vacuum conservation in the full sensitive wavelength range of MCT up to the cut-off of 10.5 μm.

Proceedings Article | 18 May 2006 Paper

AIM thermal imagers for reconnaissance and targeting applications

Rainer Breiter, Wolfgang Cabanski, Tobias Ihle, Karl-Heinz Mauk, Werner Rode

Proceedings Volume 6206, 620620 (2006) https://doi.org/10.1117/12.665016

KEYWORDS: Thermography, Unmanned aerial vehicles, Sensors, Electronics, Reconnaissance, Weapons, Infrared sensors, Laser range finders, Image processing, Digital signal processing

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Proceedings Article | 17 May 2006 Paper

Bispectral thermal imaging with quantum-well infrared photodetectors and InAs/GaSb type-II superlattices

Robert Rehm, Martin Walther, Joachim Fleißner, Johannes Schmitz, Johann Ziegler, Wolfgang Cabanski, Rainer Breiter

Proceedings Volume 6206, 62060Y (2006) https://doi.org/10.1117/12.667627

KEYWORDS: Quantum well infrared photodetectors, Stereolithography, Sensors, Cameras, Medium wave, Thermography, Superlattices, Gallium antimonide, Infrared imaging, Infrared radiation

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Proceedings Article | 29 September 2005 Paper

InAs/GaSb superlattice focal plane arrays for high-resolution thermal imaging

Robert Rehm, Martin Walther, Johannes Schmitz, Joachim Fleißner, Frank Fuchs, Johann Ziegler, Wolfgang Cabanski

Proceedings Volume 5957, 595707 (2005) https://doi.org/10.1117/12.627054

KEYWORDS: Indium arsenide, Superlattices, Gallium antimonide, Quantum efficiency, Staring arrays, Sensors, Stereolithography, Cameras, Mid-IR, Thermography

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Proceedings Article | 31 May 2005 Paper

InAs/(GaIn)Sb short-period superlattices for focal plane arrays

Robert Rehm, Martin Walther, Johannes Schmitz, Joachim Fleissner, Frank Fuchs, Wolfgang Cabanski, Johann Ziegler

Proceedings Volume 5783, (2005) https://doi.org/10.1117/12.603420

KEYWORDS: Superlattices, Diodes, Staring arrays, Sensors, Antimony, Gallium, Gallium antimonide, Indium arsenide, Photodiodes, Mid-IR

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Proceedings Article | 31 May 2005 Paper

IR sensors and imagers in networked operations

Rainer Breiter, Wolfgang Cabanski

Proceedings Volume 5783, (2005) https://doi.org/10.1117/12.603492

KEYWORDS: Sensors, Video, Infrared sensors, Imaging systems, Thermography, Standards development, Infrared imaging, Video surveillance, Unmanned aerial vehicles, Reconnaissance

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"Network-centric Warfare" is a common slogan describing an overall concept of networked operation of sensors, information and weapons to gain command and control superiority. Referring to IR sensors, integration and fusion of different channels like day/night or SAR images or the ability to spread image data among various users are typical requirements. Looking for concrete implementations the German Army future infantryman IdZ is an example where a group of ten soldiers build a unit with every soldier equipped with a personal digital assistant (PDA) for information display, day photo camera and a high performance thermal imager for every unit. The challenge to allow networked operation among such a unit is bringing information together and distribution over a capable network. So also AIM's thermal reconnaissance and targeting sight HuntIR which was selected for the IdZ program provides this capabilities by an optional wireless interface. Besides the global approach of Network-centric Warfare network technology can also be an interesting solution for digital image data distribution and signal processing behind the FPA replacing analog video networks or specific point to point interfaces. The resulting architecture can provide capabilities of data fusion from e.g. IR dual-band or IR multicolor sensors. AIM has participated in a German/UK collaboration program to produce a demonstrator for day/IR video distribution via Gigabit Ethernet for vehicle applications. In this study Ethernet technology was chosen for network implementation and a set of electronics was developed for capturing video data of IR and day imagers and Gigabit Ethernet video distribution. The demonstrator setup follows the requirements of current and future vehicles having a set of day and night imager cameras and a crew station with several members. Replacing the analog video path by a digital video network also makes it easy to implement embedded training by simply feeding the network with simulation data. The paper addresses the special capabilities, requirements and design considerations of IR sensors and imagers in applications like thermal weapon sights and UAVs for networked operating infantry forces.

Proceedings Article | 31 May 2005 Paper

Third generation focal plane array IR detection modules and applications

W. Cabanski, M. Munzberg, W. Rode, J. Wendler, J. Ziegler, J. Fleissner, F. Fuchs, R. Rehm, J. Schmitz, H. Schneider, M. Walther

Proceedings Volume 5783, (2005) https://doi.org/10.1117/12.605818

KEYWORDS: Stereolithography, Sensors, Quantum well infrared photodetectors, Mid-IR, Staring arrays, Long wavelength infrared, Missiles, Superlattices, Readout integrated circuits, Absorption

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The 3rd generation of infrared (IR) detection modules is expected to provide advanced features like higher resolution 1024x1024 or 1280x720 pixels and/or new functions like multicolor or multi band capability, higher frame rates and better thermal resolution. This paper is intended to present the current status at AIM on quantum well (QWIP) and antimonide superlattices (SL) detection modules for ground and airborne applications in the high performance range. For spectral selective detection, a QWIP detector combining 3-5μm (MWIR) and 8-10μm (LWIR) detection in each pixel with coincident integration has been developed in a 384x288x2 format with 40 μm pitch. Excellent thermal resolution with NETD < 30mK @ F/2, 6.8 ms for both peak wavelengths (4.8 μm and 8.0 μm) has been achieved. Thanks to the well established QWIP technology, the pixel outage rates even in these complex structures are below 0.5% in both bands. QWIP dual band or dual color detectors provide good resolution as long as integration times in the order of 5-10ms can be tolerated. This is acceptable for all applications where no fast motions of the platform or the targets are to be expected. For rapidly changing scenes-like e.g. in case of missile warning applications for airborne platforms-a material system with higher quantum efficiency is required to limit integration times to typically 1ms. AIM and IAF selected antimonide based type II superlattices (SL) for such kind of applications. The SL technology provides-similar to QWIP's-an accurate engineering of sensitive layers by MBE with very good homogeneity and yield. While promising results on single SL pixels have been reported since many years, so far no SL based detection module could be realized. IAF and AIM last year managed to realize first most promising SL based detectors. Fully integrated IDCA's with a MWIR SL device with 256x256 pixels in 40µm pitch have been integrated and tested. The modules exhibit excellent thermal resolution of NETD<10mk @ F/2 and 5ms. Product improvement meanwhile allowed to reduce pixel outage rates below 1% i.e. down to a level as required for the military use of such detectors. Presently under development is therefore a dual color MWIR device based on SL technology and the existing 384x288 read out circuit (ROIC) used in the dual band QWIP device. This detector is primarily intended for the use in missile approach warning systems where the dual color capability significantly improves suppression of false alarms. Details of the modules and results of the electrooptical performance will be presented for the different items mentioned above.

Proceedings Article | 7 April 2005 Paper

Infrared focal plane array based on MWIR/LWIR dual-band QWIPs: detector optimization and array properties

Harald Schneider, Thomas Maier, Joachim Fleissner, Martin Walther, Peter Koidl, Gunter Weimann, Wolfgang Cabanski, Marcus Finck, Peter Menger, Werner Rode, Johann Ziegler

Proceedings Volume 5726, (2005) https://doi.org/10.1117/12.591546

KEYWORDS: Quantum well infrared photodetectors, Mid-IR, Staring arrays, Long wavelength infrared, Sensors, Thermography, Detector arrays, Readout integrated circuits, Gallium arsenide, Infrared radiation

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Proceedings Article | 30 August 2004 Paper

HuntIR thermal imagers for reconnaissance and targeting applications

Rainer Breiter, Wolfgang Cabanski, Tobias Ihle, Karl-Heinz Mauk, Werner Rode

Proceedings Volume 5406, (2004) https://doi.org/10.1117/12.542052

KEYWORDS: Thermography, Electronics, Sensors, Weapons, Image processing, Imaging systems, Staring arrays, Control systems, Mid-IR, Reconnaissance

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Proceedings Article | 30 August 2004 Paper

Third-generation focal plane array IR detection modules and applications

Wolfgang Cabanski, Kurt Eberhardt, Werner Rode, Joachim Wendler, Johann Ziegler, Joachim Fleissner, Frank Fuchs, Robert Rehm, Johannes Schmitz, Harald Schneider, Martin Walther

Proceedings Volume 5406, (2004) https://doi.org/10.1117/12.542186

KEYWORDS: Stereolithography, Quantum well infrared photodetectors, Sensors, Mid-IR, Long wavelength infrared, Staring arrays, Superlattices, Readout integrated circuits, Quantum efficiency, Infrared detectors

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The 3rd generation of infrared (IR) detection modules is expected to provide advanced features like higher resolution 1024x1024 or 1280x720 pixels and/or new functionalities like multicolor or multi band capability, higher frame rates and better thermal resolution. This paper is intended to present the current status at AIM on the Mercury Cadmium Telluride (MCT), quantum well (QWIP) and antimonide superlattices (SL) detection modules for ground and airborne applications in the high performance range. For high resolution a 1280x720 MCT device in the 3-5μm range (MWIR) is presently under development. For spectral selective detection, a QWIP detector combining MWIR and 8-10μm (LWIR) detection in each pixel has been developed in a 384x288x2 format with 40 μm pitch, NETD < 35mK @ F/2, 6,8 ms for both peak wavelengths (4.8 μm and 8.0 μm). The device provides synchronous integration of both bands for temporal and spatial coincidence of the events observed. QWIP dual band or dual color detectors provide good resolution as long as integration times in the order of 5-10ms can be tolerated. This is acceptable for all applications where no fast motions of the platform or the targets are to be expected. For rapidly changing scenes - like e.g. in case of missile warning applications for airborne platforms - a material system with higher quantum efficiency is required to limit integration times to typically 1ms. For this case, several companies work on molecular beam epitaxy (MBE) of MCT to have access to double or multi layer structures. AIM and IAF selected antimonide based type II superlattices (SL) for such kind of applications. The SL technology provides -- similar to QWIP's -- an accurate engineering of sensitive layers by MBE with very good homogeneity and yield. While promising results on single SL pixels have been reported since many years, so far no SL based detection module could be realized. Just recently, IAF and AIM managed to realize first most promising SL based detectors. Fully integrated IDCAs with a MWIR SL device with 256 x 256 pixels in 40 μm pitch have been integrated and tested. The modules exhibit excellent thermal resolution of NETD > 12 mk @ F/2 and 5 ms. The next step will now be to stabilize the technology and to start the development of a dual color MWIR device based on SL technology and the existing 384 x 288 read out circuit (ROIC) used in the dual band QWIP device.

Proceedings Article | 19 February 2004 Paper

High-performance IR detector modules

Joachim Wendler, Wolfgang Cabanski, Ingo Ruehlich, Johann Ziegler

Proceedings Volume 5251, (2004) https://doi.org/10.1117/12.512836

KEYWORDS: Sensors, Staring arrays, Electronics, Infrared detectors, Quantum well infrared photodetectors, Control systems, Signal detection, Forward looking infrared, Thermography, Video

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Proceedings Article | 10 October 2003 Paper

AIM image processing electronics for FPA IR detection modules

Rainer Breiter, Wolfgang Cabanski, R. Koch, Karl-Heinz Mauk, Werner Rode

Proceedings Volume 5074, (2003) https://doi.org/10.1117/12.488023

KEYWORDS: Image processing, Sensors, Thermography, Electronics, Digital signal processing, Staring arrays, Nonuniformity corrections, Infrared detection, Infrared imaging, Mid-IR

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Proceedings Article | 10 October 2003 Paper

Status of third-generation focal plane array IR detection modules at AIM

Wolfgang Cabanski, Rainer Breiter, Karl-Heinz Mauk, Werner Rode, Johann Ziegler, H. Schneider, M. Walther, Reinhard Oelmaier

Proceedings Volume 5074, (2003) https://doi.org/10.1117/12.488020

KEYWORDS: Quantum well infrared photodetectors, Sensors, Mid-IR, Staring arrays, Missiles, Long wavelength infrared, Quantum efficiency, Image processing, Image resolution, Capacitance

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Proceedings Article | 23 January 2003 Paper

High-resolution QWIP FPAs for the 8- to 12-µm and 3- to 5-µm regimes

Harald Schneider, Joachim Fleissner, Robert Rehm, Martin Walther, Wilfried Pletschen, Peter Koidl, Guenter Weimann, Johann Ziegler, Rainer Breiter, Wolfgang Cabanski

Proceedings Volume 4820, (2003) https://doi.org/10.1117/12.451319

KEYWORDS: Quantum well infrared photodetectors, Mid-IR, Staring arrays, Long wavelength infrared, Sensors, Quantum efficiency, Quantum wells, Cameras, Thermography, Diffraction gratings

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Proceedings Article | 6 August 2002 Paper

Multicolor and dual-band IR camera for missile warning and automatic target recognition

Rainer Breiter, Wolfgang Cabanski, Karl-Heinz Mauk, Werner Rode, Johann Ziegler, Harald Schneider, Martin Walther

Proceedings Volume 4718, (2002) https://doi.org/10.1117/12.478815

KEYWORDS: Missiles, Mid-IR, Sensors, Quantum well infrared photodetectors, Thermography, Cameras, Optical filters, Infrared cameras, Automatic target recognition, Long wavelength infrared

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Proceedings Article | 5 August 2002 Paper

Broadband and dual-color high-speed MCT MWIR modules

Wolfgang Cabanski, Rainer Breiter, Karl-Heinz Mauk, Werner Rode, Johann Ziegler

Proceedings Volume 4721, (2002) https://doi.org/10.1117/12.478845

KEYWORDS: Mid-IR, Quantum well infrared photodetectors, Long wavelength infrared, Sensors, Missiles, Staring arrays, Nonuniformity corrections, Cameras, Quantum efficiency, Data conversion

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Proceedings Article | 5 August 2002 Paper

QWIP LWIR cameras with NETD<10 mK and improved low-frequency drift for long observation time in medicine and research

Wolfgang Cabanski, Rainer Breiter, Werner Rode, Johann Ziegler, Harald Schneider, Martin Walther, Mark Fauci

Proceedings Volume 4721, (2002) https://doi.org/10.1117/12.478843

KEYWORDS: Quantum well infrared photodetectors, Cameras, Infrared imaging, Thermography, Medical imaging, Medicine, Staring arrays, Infrared radiation, Imaging systems, Infrared cameras

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Proceedings Article | 5 August 2002 Paper

Improved HgCdTe technology for high-performance infrared detectors

Johann Ziegler, Martin Bruder, Wolfgang Cabanski, Heinrich Figgemeier, Marcus Finck, Peter Menger, Thomas Simon, Richard Wollrab

Proceedings Volume 4721, (2002) https://doi.org/10.1117/12.478853

KEYWORDS: Staring arrays, Diodes, Sensors, Mercury cadmium telluride, Standards development, Modulation transfer functions, Reliability, Medium wave, Analog electronics, Etching

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Proceedings Article | 10 October 2001 Paper

Third-generation focal plane array IR detection modules at AIM

Wolfgang Cabanski, Rainer Breiter, R. Koch, Karl-Heinz Mauk, Werner Rode, Johann Ziegler, Harald Schneider, Martin Walther, Reinhard Oelmaier

Proceedings Volume 4369, (2001) https://doi.org/10.1117/12.445314

KEYWORDS: Quantum well infrared photodetectors, Sensors, Mid-IR, Staring arrays, Nonuniformity corrections, Long wavelength infrared, Optical filters, Digital signal processing, Thermography, Electronics

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According to the common understanding, the 3rd generation of infrared (IR) detection modules is expected to provide advanced functionalities like more pixels, multicolor or multiband capability, higher frame rates and better thermal resolution. This paper is intended to present the present status at AIM on such technologies. A high speed device with 256 X 256 pixels in a 40μm pitch is designed to provide up to 800 Hz full frame rate with pixel rates as high as 80 Mpixels/s. The read out circuit is designed to stare while scan in a flash integration mode to allow nearly full frame integration for even 800 Hz frame rate. A miniaturized command and control electronics with 14 Bit deep digital output and a non uniformity correction board capable to take into account non linear self learning scene based correction models are developed together with the integrated detector cooler assembly (IDCA). As working horse for dual color/band capabilities, AIM has developed a sequential multi color module to provide customers with a flexible tool to analyze the pros and cons of spectral selective detection. The module is based on a 384x288 mercury cadmium telluride (MCT) detector available in the mid wave (MWIR) or long wave spectral band (LWIR). A rotating wheel with 4 facets for filters or microscanner plates provides spectral selectivity. AIM's programmable MVIP image processing is used for controlling the detector and for non uniformity correction. The MVIP allows set the integration time and NUC coefficients individually for each filter position for comparable performance to accurately evaluate the pay off of spectral selectivity in the IR. In parallel, a dual color detector FPA is under development. The FPA is realized as a MCT MWIR device, LWIR, however, is also doable. Dual color macro cells are realized with 192x192 pixels in a pitch of effectively 56 μm. The cell design provides, that both colors detect radiation from target points identical within the limited resolution of the optics to ensure coincident detection plus compensates the significant variation in photon flux of the different colors to output the analog signal at approximately the same level for good thermal resolution and correctability. The photovoltaic device is realized using AIM's mature liquid phase epitaxy. Since quantum well (QWIP) technology has proven state of the art results based on a well established material system, AIM is heading for QWIP devices for most affordable solutions in the MWIR/LWIR dual band applications. A summary of state of the art results achieved so far as basis for a QWIP dual band detector is presented.

Proceedings Article | 10 October 2001 Paper

Portable sequential multicolor thermal imager based on a MCT 384 x 288 focal plane array

Rainer Breiter, Wolfgang Cabanski, Karl-Heinz Mauk, Werner Rode, Johann Ziegler

Proceedings Volume 4369, (2001) https://doi.org/10.1117/12.445317

KEYWORDS: Optical filters, Thermography, Sensors, Staring arrays, Mid-IR, Image processing, Filtering (signal processing), Image filtering, Imaging systems, Control systems

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AIM has developed a sequential multicolor thermal imager to provide customers with a test system to realize real-time spectral selective thermal imaging. In contrast to existing PC based laboratory units, the system is miniaturized with integrated signal processing like non-uniformity correction and post processing functions such as image subtraction of different colors to allow field tests in military applications like detection of missile plumes or camouflaged targets as well as commercial applications like detection of chemical agents, pollution control, etc. The detection module used is a 384x288 mercury cadmium telluride (MCT) focal plane array (FPA) available in the mid wave (MWIR) or long wave spectral band LWIR). A compact command and control electronics (CCE) provides clock and voltage supply for the detector as well as 14 bit deep digital conversion of the analog detector output. A continuous rotating wheel with four facets for filters provides spectral selectivity. The customer can choose between various types of filter characteristics, e.g. a 4.2 μm bandpass filter for CO₂ detection in the MWIR band. The rotating wheel can be synchronized to an external source giving the rotation speed, typical 25 l/s. A position sensor generates the four frame start signals for synchronous operation of the detector -- 100 Hz framerate for the four frames per rotation. The rotating wheel is exchangeable for different configurations and also plates for a microscanner operation to improve geometrical resolution are available instead of a multicolor operation. AIM's programmable MVIP image processing unit is used for signal processing like non- uniformity correction and controlling the detector parameters. The MVIP allows to output the four subsequent images as four quarters of the video screen to prior to any observation task set the integration time for each color individually for comparable performance in each spectral color and after that also to determine separate NUC coefficients for each filter position. This procedure allows to really evaluate the pay off of spectral selectivity in the IR. The display part of the MVIP allows linear look up tables (LUT) for dynamic reduction as well as histogram equalization for automatic LUT optimization. Parallel to the video output a digital interface is provided for digital recording of the 14 bit corrected detector data. The architecture of the thermal imager with its components is presented in this paper together with some aspects on multicolor thermal imaging.

Proceedings Article | 15 December 2000 Paper

New MCT focal plane array IR detection modules and digital signal processing technologies at AIM

Wolfgang Cabanski, Rainer Breiter, Karl-Heinz Mauk, Werner Rode, Richard Wollrab, Johann Ziegler, Kurt Eberhardt, Reinhard Oelmaier

Proceedings Volume 4130, (2000) https://doi.org/10.1117/12.409843

KEYWORDS: Mid-IR, Staring arrays, Quantum well infrared photodetectors, Image filtering, Digital signal processing, Nonuniformity corrections, Sensors, Target detection, Optical filters, Long wavelength infrared

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Proceedings Article | 15 December 2000 Paper

Low-noise QWIPs for FPA sensors with high thermal resolution

Harald Schneider, Martin Walther, Joachim Fleissner, Robert Rehm, E. Diwo, K. Schwarz, Peter Koidl, Guenter Weimann, Johann Ziegler, Rainer Breiter, Wolfgang Cabanski

Proceedings Volume 4130, (2000) https://doi.org/10.1117/12.409877

KEYWORDS: Quantum well infrared photodetectors, Sensors, Staring arrays, Cameras, Imaging systems, Quantum wells, Long wavelength infrared, Electrons, Gallium arsenide, Infrared sensors

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Proceedings Article | 17 July 2000 Paper

Miniaturized high-performance starring thermal imaging system

Wolfgang Cabanski, Rainer Breiter, Karl-Heinz Mauk, Werner Rode, Johann Ziegler, L. Ennenga, Ulrich Lipinski, T. Wehrhahn

Proceedings Volume 4028, (2000) https://doi.org/10.1117/12.391734

KEYWORDS: Electronics, Video, Imaging systems, Thermography, Reconnaissance systems, Interfaces, Control systems, Staring arrays, Cameras, Sensors

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A high resolution thermal imaging system was developed based on a 384 X 288 mercury cadmium telluride (MCT) mid wave (MWIR) infrared (IR) detection module with a 2 X 2 microscan for improved geometrical resolution. Primary design goal was a long identification range of 3 km and high system performance for adverse weather conditions achieved by a system with small entrance pupil and minimized dimensions to fit for integration in existing apertures of armored vehicles, reconnaissance systems and stabilized platforms. A staring FPA module with its potential for long integration times together with a microscan for improved geometrical resolution provides the answers best fit to these requirements. A robust microscanner was developed to fit for military requirements and integrated with AIM's 384 X 288 MCT MWIR module and data processing. The modules allow for up to 2 ms integration time with 25 Hz frame rate and output a 768 X 576 high resolution CCIR standard image. The video image processing (VIP) provides the calculation power for scene based self learning nonuniformity correction (NUC) algorithms to save calibration sources. This NUC algorithm allows take into account non linear effects for unsurpassed performance in highly dynamic scenes. The detection module and VIP are designed to interface with STN's mature system electronics, used e.g. in hundreds of OPHELIOS thermal camera sets fielded. The system electronics provides a lot of different interface features like double serial control bus (CANBUS) interface, analog and digital outputs as well as different video outputs. The integrated graphic generation part allows to put advanced graphic overlays to the thermal image and also to external video signals via the video input feature. This electronics provides the power supply for the whole thermal imaging system as well as different processor controlled algorithms for field of view or zoom drives, focus drives, athermalization and temperature control of the FLIR. A new zoom lens F/2.0 allows to select field of views from 2 degree to 15 degrees horizontal. This covers a wide area of military and paramilitary applications. The whole camera is miniaturized to fit into existing gunner and commander sights for main battle tanks as well as for infantry fighting vehicles. The overall design is compatible in optical, electrical and mechanical direction with the fielded OPHELIOS cameras and so an easy upgrade for existing fire control, reconnaissance and platform systems. The overall design is made under consideration of mil standard environments and is able to withstand vehicle, airborne and shipborne stress. The presentation gives an overview of the different components of the new camera system. Theoretical range performance data are discussed together with measured NETD, MTF and MRTD data of the unit.

Proceedings Article | 17 July 2000 Paper

High-resolution focal plane array IR detection modules and digital signal processing technologies at AIM

Wolfgang Cabanski, Rainer Breiter, R. Koch, Karl-Heinz Mauk, Werner Rode, Johann Ziegler, Kurt Eberhardt, Reinhard Oelmaier, Harald Schneider, Martin Walther

Proceedings Volume 4028, (2000) https://doi.org/10.1117/12.391723

KEYWORDS: Quantum well infrared photodetectors, Mid-IR, Image filtering, Staring arrays, Sensors, Digital signal processing, Optical filters, Filtering (signal processing), Infrared imaging, Long wavelength infrared

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Full video format focal plane array (FPA) modules with up to 640 X 512 pixels have been developed for high resolution imaging applications in either mercury cadmium telluride (MCT) mid wave (MWIR) infrared (IR) or platinum silicide (PtSi) and quantum well infrared photodetector (QWIP) technology as low cost alternatives to MCT for high performance IR imaging in the MWIR or long wave spectral band (LWIR). For the QWIP's, a new photovoltaic technology was introduced for improved NETD performance and higher dynamic range. MCT units provide fast frame rates > 100 Hz together with state of the art thermal resolution NETD < 20 mK for short snapshot integration times of typically 2 ms. PtSi and QWIP modules are usually operated in a rolling frame integration mode with frame rates of 30 - 60 Hz and provide thermal resolutions of NETD < 80 mK for PtSi and NETD < 20 mK for QWIP, respectively. Due to the lower quantum efficiency compared to MCT, however, the integration time is typically chosen to be as long 10 - 20 ms. The heat load of the integrated detector cooler assemblies (IDCAs) could be reduced to an amount as low, that a 1 W split liner cooler provides sufficient cooling power to operate the modules -- including the QWIP with 60 K operation temperature -- at ambient temperatures up to 65 degrees Celsius. Miniaturized command/control electronics (CCE) available for all modules provide a standardized digital interface, with 14 bit analogue to digital conversion for state to the art correctability, access to highly dynamic scenes without any loss of information and simplified exchangeability of the units. New modular image processing hardware platforms and software for image visualization and nonuniformity correction including scene based self learning algorithms had to be developed to accomplish for the high data rates of up to 18 M pixels/s with 14-bit deep data, allowing to take into account nonlinear effects to access the full NETD by accurate reduction of residual fixed pattern noise. The main features of these modules are summarized together with measured performance data for long range detection systems with moderately fast to slow F-numbers like F/2.0 - F/3.5. An outlook shows most recent activities at AIM, heading for multicolor and faster frame rate detector modules based on MCT devices.

Proceedings Article | 30 March 2000 Paper

High-performance focal plane array modules for research and development

Rainer Breiter, Wolfgang Cabanski, Johann Ziegler, Martin Walther, Harald Schneider

Proceedings Volume 4020, (2000) https://doi.org/10.1117/12.381558

KEYWORDS: Quantum well infrared photodetectors, Thermography, Staring arrays, Image processing, Mid-IR, Sensors, Digital signal processing, Analog electronics, Nonuniformity corrections, Cameras

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Proceedings Article | 26 July 1999 Paper

High-resolution QWIP and MCT FPA modules at AIM

Rainer Breiter, Wolfgang Cabanski, R. Koch, Werner Rode, Johann Ziegler, Kurt Eberhardt, Reinhard Oelmaier, Martin Walther

Proceedings Volume 3698, (1999) https://doi.org/10.1117/12.354541

KEYWORDS: Quantum well infrared photodetectors, Mid-IR, Staring arrays, Long wavelength infrared, Electronics, Photovoltaics, Sensors, Capacitance, Mercury cadmium telluride, Analog electronics

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Proceedings Article | 26 July 1999 Paper

High-performance nonuniformity correction hard- and software for FPA modules at AIM

Rainer Breiter, Wolfgang Cabanski, Wolfgang Fick, Karl-Heinz Mauk

Proceedings Volume 3698, (1999) https://doi.org/10.1117/12.354580

KEYWORDS: Nonuniformity corrections, Sensors, Long wavelength infrared, Video processing, Video, Image processing, Staring arrays, Quantum well infrared photodetectors, Mid-IR, Digital signal processing

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Proceedings Article | 19 March 1999 Paper

Mid-infrared silicon/germanium focal plane detector arrays

Hartmut Presting, Johannes Konle, Markus Hepp, Horst Kibbel, Klaus Thonke, Rolf Sauer, Wolfgang Cabanski, Milan Jaros

Proceedings Volume 3630, (1999) https://doi.org/10.1117/12.342804

KEYWORDS: Sensors, Silicon, Staring arrays, Germanium, Quantum wells, Doping, Detector arrays, Oxides, Mid-IR, Boron

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Proceedings Article | 26 October 1998 Paper

Focal plane arrays: MCT, quantum wells, PtSi

Rainer Breiter, Wolfgang Cabanski, R. Koch, Werner Rode, Johann Ziegler

Proceedings Volume 3436, (1998) https://doi.org/10.1117/12.328033

KEYWORDS: Quantum well infrared photodetectors, Electronics, Long wavelength infrared, Nonuniformity corrections, Staring arrays, Mid-IR, Image processing, Sensors, Temperature metrology, Analog electronics

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Proceedings Article | 26 October 1998 Paper

IR modules and long-life Stirling cryocoolers at AIM

Herbert Korf, Wolfgang Cabanski, C. Wendler, U. Wild, Johann Ziegler

Proceedings Volume 3436, (1998) https://doi.org/10.1117/12.328034

KEYWORDS: Staring arrays, Reliability, Sensors, Cryocoolers, Product engineering, Yield improvement, Packaging, Electronics, Long wavelength infrared, Data processing

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Proceedings Article | 26 October 1998 Paper

III-V semiconductor quantum well and superlattice detectors

Martin Walther, Frank Fuchs, Harald Schneider, Joachim Fleissner, J. Schmitz, Wilfried Pletschen, Juergen Braunstein, Johann Ziegler, Wolfgang Cabanski, Peter Koidl, Guenter Weimann

Proceedings Volume 3436, (1998) https://doi.org/10.1117/12.328032

KEYWORDS: Sensors, Staring arrays, Quantum well infrared photodetectors, Cameras, Gallium arsenide, Quantum wells, Diodes, Thermography, Long wavelength infrared, Chemical elements

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Proceedings Article | 22 July 1998 Paper

Recent developments for high-performance staring IR imaging modules at AIM

Rainer Breiter, Wolfgang Cabanski, Karl-Heinz Mauk, Werner Rode, Johann Ziegler, Kurt Eberhardt, Reinhard Oelmaier

Proceedings Volume 3379, (1998) https://doi.org/10.1117/12.317601

KEYWORDS: Long wavelength infrared, Mid-IR, Image processing, Infrared imaging, Staring arrays, Quantum well infrared photodetectors, Video processing, Video, Black bodies, Nonuniformity corrections

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Proceedings Article | 22 July 1998 Paper

Recent developments for QWIP IR imaging modules at AIM

Rainer Breiter, Wolfgang Cabanski, R. Koch, Werner Rode, Johann Ziegler, Kurt Eberhardt, Reinhard Oelmaier

Proceedings Volume 3379, (1998) https://doi.org/10.1117/12.317610

KEYWORDS: Quantum well infrared photodetectors, Nonuniformity corrections, Sensors, Staring arrays, Temperature metrology, Electronics, Algorithm development, Detection and tracking algorithms, Cameras, Gallium arsenide

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Proceedings Article | 13 August 1997 Paper

Novel silicon/germanium infrared detectors grown by MBE

Hartmut Presting, Juergen Uschmann, Markus Hepp, Klaus Thonke, Rolf Sauer, Horst Kibbel, Wolfgang Cabanski, Milan Jaros

Proceedings Volume 3061, (1997) https://doi.org/10.1117/12.280399

KEYWORDS: Silicon, Sensors, Doping, Quantum wells, Quantum efficiency, Absorption, Boron, Modulation, Infrared detectors, Germanium

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Proceedings Article | 13 August 1997 Paper

Technologies of high-performance thermography systems

Rainer Breiter, Wolfgang Cabanski, Karl-Heinz Mauk, R. Koch, Werner Rode

Proceedings Volume 3061, (1997) https://doi.org/10.1117/12.280312

KEYWORDS: Digital signal processing, Interfaces, Electronics, Staring arrays, Signal processing, Video processing, Image processing, Cameras, Data corrections, Thermography

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Proceedings Article | 17 June 1996 Paper

AEG PtSi modules: a summary

Wolfgang Cabanski, R. Koch, Horst Maier, G. Pahler, C. Wendler, Johann Ziegler, Karl Hofmann, Kurt Eberhardt, Peter Deimel, U. Prechtel, K. Kapser

Proceedings Volume 2746, (1996) https://doi.org/10.1117/12.243048

KEYWORDS: Staring arrays, Digital signal processing, Electronics, Diodes, Clocks, Sensors, Quantum efficiency, Multiplexers, Signal processing, Digital electronics

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Proceedings Article | 15 July 1994 Paper

Development of hybrid PtSi focal plane arrays

Wolfgang Cabanski, R. Koch, Horst Maier, C. Wendler, Johann Ziegler

Proceedings Volume 2225, (1994) https://doi.org/10.1117/12.179723

KEYWORDS: Staring arrays, Multiplexers, Detector development, Analog electronics, Switching, Clocks, Microelectronics, Sensors

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Proceedings Article | 1 August 1991 Paper

Electronic and optical properties of silicide/silicon IR detectors

Wolfgang Cabanski, Max Schulz

Proceedings Volume 1484, (1991) https://doi.org/10.1117/12.46510

KEYWORDS: Scattering, Interfaces, Sensors, Silicon, Infrared detectors, Absorption, Quantum efficiency, Thin films, Metals, Spectroscopy

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Showing 5 of 42 publications

Conference Committee Involvement (28)

Infrared Technology and Applications L

21 April 2024 | National Harbor, Maryland, United States

Infrared Technology and Applications XLIX

30 April 2023 | Orlando, Florida, United States

Infrared Technology and Applications XLVIII

3 April 2022 | Orlando, Florida, United States

Infrared Technology and Applications XLVII

12 April 2021 | Online Only, Florida, United States

Infrared Technology and Applications XLVI

27 April 2020 | Online Only, California, United States

Infrared Technology and Applications XLV

14 April 2019 | Baltimore, MD, United States

Infrared Technology and Applications XLIV

16 April 2018 | Orlando, FL, United States

Infrared Technology and Applications XLIII

9 April 2017 | Anaheim, CA, United States

Infrared Technology and Applications XLII

18 April 2016 | Baltimore, MD, United States

Infrared Technology and Applications XLI

20 April 2015 | Baltimore, MD, United States

Infrared Technology and Applications XL

5 May 2014 | Baltimore, MD, United States

Infrared Technology and Applications XXXIX

29 April 2013 | Baltimore, Maryland, United States

Detectors and Associated Signal Processing V

27 November 2012 | Barcelona, Spain

Infrared Technology and Applications XXXVIII

23 April 2012 | Baltimore, Maryland, United States

Detectors and Associated Signal Processing IV

5 September 2011 | Marseille, France

Infrared Technology and Applications XXXVII

25 April 2011 | Orlando, Florida, United States

Infrared Technology and Applications XXXVI

5 April 2010 | Orlando, Florida, United States

Infrared Technology and Applications XXXV

13 April 2009 | Orlando, Florida, United States

Detectors and Associated Signal Processing

4 September 2008 | Glasgow, Scotland, United Kingdom

Infrared Technology and Applications XXXIV

17 March 2008 | Orlando, Florida, United States

Infrared Technology and Applications XXXIII

9 April 2007 | Orlando, Florida, United States

Infrared Technology and Applications XXXII

17 April 2006 | Orlando (Kissimmee), Florida, United States

Detectors and Associated Signal Processing II

13 September 2005 | Jena, Germany

Infrared Technology and Applications XXXI

28 March 2005 | Orlando, Florida, United States

Infrared Detectors and Focal Plane Arrays VIII

2 August 2004 | Denver, Colorado, United States

Infrared Technology and Applications XXX

12 April 2004 | Orlando, Florida, United States

Detectors and Associated Signal Processing

1 October 2003 | St. Etienne, France

Infrared Technology and Applications XXIX

21 April 2003 | Orlando, Florida, United States

Showing 5 of 28 Conference Committees

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